YSEALI TechCamp Reconnect Workshop

A Generation of Advocates. That is the goal of Southeast Asia’s first ever YSEALI TechCamp Reconnect workshop. Taking place in Bangkok May 14-15, YSEALI TechCamp Reconnect brings together 36 YSEALI Network members from all ten ASEAN countries, most of whom have participated in previous TechCamps. Participants are working with technology experts and trainers to improve ... Read More»

By | 14 May, 2018 | Topics: Deputy Chief of Mission, Events, News | Tags: ,

Ambassador Davies at TechCamp Thailand

On May 17, Ambassador Davies thanked 60 participants from Thailand, Malaysia, Indonesia, and the Philippines for participating in “TechCamp Thailand.” The TechCamp participants spent the last two days learning from 15 global and regional expert trainers how to use developing technologies to promote peace and dialogue in their local communities. The U.S. Embassy will provide ... Read More»

By | 17 May, 2017 | Topics: Ambassador, East Asia & Pacific, Education, Events, News, Science & Tech | Tags:

The Opening Ceremony of TechCamp Thailand

On May 16, Deputy Chief of Mission Peter Haymond welcomed to Bangkok 60 participants from Thailand, Malaysia, Indonesia, and the Philippines to “TechCamp Thailand.” The theme for the U.S. Embassy sponsored camp is “Promoting Peace and Dialogue through Technology.” It features trainers from around the globe providing showcases and expertise on technologies such as online ... Read More»

By | 16 May, 2017 | Topics: Deputy Chief of Mission, East Asia & Pacific, Education, Events, News, Science & Tech | Tags:

Great Seal of the United States

Notice of Funding Opportunity (NOFO): Promoting Peace and Dialogue with Technology: TechCamp Thailand 2017

Application Deadline: March 31, 2017 Description The U.S. Embassy, Public Affairs Section in Bangkok is soliciting proposals for a grant from eligible organizations to develop and host the “Promoting Peace and Dialogue with Technology” Technology Camp (TechCamp) in May 2017. Specific goals, objectives, and technical requirements for application packages are detailed below. IIP anticipates awarding up ... Read More»

By | 27 February, 2017 | Topics: News | Tags:

Show More ∨